CompactPCI boards suit tough applications

The passively cooled Kontron CP6001 has up to 4Gbyte of soldered RAM and soldered application flash comes in three rugged levels

Kontron has released the CP6001, a 6U CompactPCI PICMG 2.16 compliant board. Based on the Intel Core Duo/Core2 Duo processor and mobile chipset, the Kontron CP6001 features high computing and graphic performance with a low thermal design power and a complete set of data, communication and multimedia interfaces.
Designed to withstand even the toughest environmental conditions, the passively cooled Kontron CP6001 has up to 4Gbyte of soldered RAM and soldered application flash and comes in three rugged levels; R1, R2 and R3.

All three versions are available with E2 capabilities and an extended temperature range from -40C to + 85C.

The R1-version is designed for standard application requirements in air-cooled environments.
The R2-version is rugged for high shock and vibration environments in accordance with the VITA 47 EAC6 specification.

The R3-version is fully conduction cooled and meets VITA 47's ECC4 requirements.

These three versions make the Kontron CP6001 suitable for use with the CP6923 PICMG2.16 Ethernet switch board, which Kontron has already deployed as an R1-version and will make available for the R2 and R3 rugged levels.

Together, these 6U CompactPCI boards provide a cost-effective alternative for rugged, high demand systems in a variety of markets, including military and aerospace applications.

The Kontron CP6001 features energy efficient embedded Intel dual core processors.

It has a 1.2GHz Intel Core Duo U2500 ULV processor and a 1.5GHz Intel Core 2 Duo L7400 LV processor.

Based on the Intel Mobile 945GM chipset with a front side bus of up to 667MHz and ICH7-R Southbridge, the Kontron CP6001 provides high graphics performance for the two independent digital video outputs to the rear I/O (2x DVI - 1 x DVI and 1x HDMI) as well as AC97 audio capabilities.

With up to 8Gbyte of USB or 2Gbyte soldered flash, the Kontron CP6001 enables the construction of highly shock and vibration-resistant systems with nonrotating, nonvolatile memory.